Description
Product Specifications
Products Description
Tags:
Product Specifications
| Project | Content |
Product Type | LGA, QFN, BGA, QFP, SOP |
| 2D Inspection | Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls |
| 3D Inspection | BGA height, coplanarity |
| Product Size | 3mmX3mm-120mmX120mm |
Support Incoming Materials | Tray to Tray&Tray to Reel |
| 2D Visual System | 25MP |
Pixel Resolution | 10μm/pixel |