Description
Product Specifications
Products Description
Tags:
Product Specifications
| Project | Content |
| Product Type | 6-inch, 8-inch, 12-inch patterned wafers |
| Inspection Items | Wafer Thickness, Bump Height, Roughness, TSV, Grooving Depth, CD/Overlay, Warpage/Bow/TTV, RST, SOH, HBM die shift, Dishing Measurement, etc. |
| Inspection Precision | Thickness:0.01um Height:0.1um Roughness:0.1nm CD/Overlay:0.05um @ 1σ |
| UPH | CD Size/Coverage Metrology: 12 inches ≥ 60WPH (inspection during production) |